Chip arrangement and method of manufacturing the same

ABSTRACT

A chip arrangement is provided which comprises a carrier; and at least two chips arranged over the carrier; wherein a continuous insulating layer is arranged between the at least two chips and between the carrier and at least one of the at least two chips.

TECHNICAL FIELD

Various embodiments relate to a chip arrangement and to a method ofmanufacturing a chip arrangement.

BACKGROUND

Methods of manufacturing chip arrangements, in particular multi-chiparrangements, are well known in the art. In the case of multi-chiparrangements, a plurality of chips is typically arranged side-by-side orchip-by-chip and contacted by contact lines, conductors, bonding wiresor the like. In such multi-chip arrangements the electrical insulationbetween the single chips is very important in order to maintain theoperation of the chip arrangement. Therefore, a method of manufacturinga multi-chip arrangement providing sufficient insulating between thedifferent chips is needed.

SUMMARY

Various embodiments provide a chip arrangement comprising a carrier; andat least two chips arranged over the carrier; wherein a continuousinsulating layer is arranged between the at least two chips and betweenthe carrier and at least one of the at least two chips.

Furthermore, various embodiments provide a chip arrangement comprising acarrier; a first chip arranged on the carrier; and a second chiparranged on a continuous insulating layer and beside the first chip,wherein the continuous insulating layer is arranged on the first chip.

Moreover, various embodiments provide a method for manufacturing a chiparrangement, the method comprising arranging a first chip on a carrier;arranging a second chip on a continuous insulating layer; and arrangingthe continuous insulating layer on the first chip arranged on thecarrier.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. The drawings are not necessarilyto scale. Instead emphasis is generally being placed upon illustratingthe principles of the invention. In the following description, variousembodiments are described with reference to the following drawings, inwhich:

FIG. 1A to FIG. 1H show steps of a manufacturing method of a chiparrangement according to an exemplary embodiment.

FIG. 2 shows a part of an alternative method of manufacturing method ofa chip arrangement.

FIG. 3 shows a simplified flowchart of a method of manufacturing a chiparrangement.

DETAILED DESCRIPTION

In the following further exemplary embodiments of a semiconductor deviceand a method of manufacturing a semiconductor device will be explained.It should be noted that the description of specific features describedin the context of one specific exemplary embodiment may be combined withothers exemplary embodiments as well.

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration”. Any embodiment or design described herein as“exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs.

Various embodiments provide a chip arrangement and a method ofmanufacturing a chip arrangement comprising at least two chips arrangedon a carrier or chip carrier and comprising a continuous insulatinglayer arranged between a first one of the at least to chips and a secondone of the at least two chips.

In particular, one of the at least two chips may be a power chip and theother one may be a logic chip. In particular, the continuous insulatinglayer may be a dielectric foil, which may have a thickness in a rangebetween 2 micrometer and 100 micrometer, preferably in the range between5 micrometer and 50 micrometer. For example the continuous insulatinglayer may be formed by chemical vapor deposition.

It should be noted that the continuous insulating layer may be arrangedor placed directly on the first chip or additional elements or layersmay be arranged between the first chip and the continuous insulatinglayer.

In the method for manufacturing a chip arrangement the continuousinsulating layer may be particularly arranged on the first chip in sucha way that the continuous insulating layer is arranged between thesecond chip and the carrier. In particular, a plurality of first chips,e.g. at least two, may be placed or arranged on the carrier, e.g. on thecarrier and/or fixed to the carrier by a solder or adhesive, and/or aplurality of second chips may be placed on the continuous insulatinglayer, e.g. a dielectric foil. Preferably, the plurality of first chipsand/or second chips may be placed side-by-side to each other on thecarrier and continuous insulating layer, respectively. It should bementioned that the terms “first chip” and “second chip” do notnecessarily mean that the first chip and the second chip are differentin functionality. The terms rather relate to the fact that the firstchip(s) is/are placed on the carrier, while the second chip(s) is/areplaced on the continuous insulating layer. For example, the continuousinsulating layer may be expandable or elastic.

The term “continuous layer” may particularly denote a layer, e.g. of aninsulating material, which is formed as a single continuous homogenouslayer, e.g. a single laminate layer. In a continuous layer nodiscontinuous change between different subsections is present. Thus, ithas to be distinguished from a layer which is formed by differentsubsections or different sublayers, e.g. a subsection comprising anadhesive and another one comprising a prepreg, for example.

The term “over” may particularly denote, that one element or layer isarranged on one side of another element or layer but not necessarilydirect on the another element or layer. That is, the term “over” doesnot exclude that other layers or elements are arranged between.

According to an exemplary embodiment of the chip arrangement the carriercomprises an electric conductive material.

In particular, the carrier may consist of an electric conductivematerial. For example, the carrier may be a lead frame or a metalcarrier. Examples for materials, which may be used, are metal (e.g.copper, silver, or aluminium), conductive plastic and conductiveceramics, or the like. However, alternatively non-conductive materialsmay be used for the carrier, e.g. (non-conductive) plastic or(non-conductive) ceramics. Preferably the chip arranged over or on thecarrier is electrically connected to the carrier.

According to an exemplary embodiment of the chip arrangement theinsulating layer comprises a material which has a melting temperature ofabove 200° C.

In particular, the melting temperature may be above 250° C., e.g. atleast 260° C. which is a temperature which is often used for solderingprocesses. When using an insulating material having a melting ordecomposing temperature above the soldering temperature it may bepossible to perform soldering steps afterwards without damaging theinsulating layer.

According to an exemplary embodiment of the chip arrangement theinsulating layer comprising at least one material out of the groupconsisting of: a thermoset material; a thermoplast material; a rubbermaterial; and a mixture thereof.

In general, the used materials may be materials having a melting ordecomposition temperature above 200° C. In particular, the thermoplastor plastomer material may be high quality material. High qualitymaterial may particularly denote a material having a melting ordecomposition temperature above 200° C., in particular above 250° C.,e.g. above 260° C.

According to an exemplary embodiment of the chip arrangement thecontinuous insulating layer is a laminate layer.

In particular, the continuous insulating layer may consist of ahomogenous material. Thus, it has to be distinguished from a layer whichis pieced together.

According to an exemplary embodiment the chip arrangement furthercomprises an encapsulation layer which is arranged over the at least twochips.

In particular, the encapsulation layer may be formed by or may comprisea mold material and/or may be formed by a further (continuous) layer,e.g. a laminate layer, which is arranged over the at least two chips andforming a part of a passivation of the chip arrangement. Theencapsulation layer may have a thickness between 10 micrometer and 400micrometer, preferably in the range between 20 micrometer and 200micrometer.

According to an exemplary embodiment the chip arrangement furthercomprises interconnections extending through the encapsulation layer.

In particular, the chip arrangement may only comprise interconnectionsextending through the encapsulation layer. That is, the carrier may befree of any interconnections formed through the carrier.

According to an exemplary embodiment of the chip arrangement thecontinuous insulating layer is adapted to act as an adhesive materialfor the at least one of the at least two chips.

According to an exemplary embodiment of the chip arrangement the carrierhas a thickness in a range between 100 micrometer and 1,000 micrometer.

In particular, the carrier may be a leadframe or a laminate layer.However, it is preferred that the carrier is not a common printedcircuit board. That is, the term “carrier” may particularly denote anysubstantially two-dimensional element or support which isself-supporting or rigidly enough to support itself and chips arrangedon the same, but is not formed by a printed circuit board.

According to an exemplary embodiment of the chip arrangement thecontinuous insulating layer is arranged on at least three sides of thefirst chip.

In particular, the continuous insulating layer is covering the firstchip on at least three sides, e.g. on five sides. For example, thecontinuous insulating layer may cover the first chip on all sides excepton the side where the first chip is arranged on the carrier.

According to an exemplary embodiment the chip arrangement furthercomprises an encapsulation layer.

According to an exemplary embodiment of the method for manufacturing achip arrangement the continuous insulating layer comprising a materialwhich is adhesive when the second chip is arranged on the continuousinsulating layer.

In particular, the material may be a precured material. Examples for theprecured material may be, e.g. a precured thermoset material, a precuredhigh quality thermoplast plastomer material.

According to an exemplary embodiment the method for manufacturing a chiparrangement further comprises arranging an encapsulation layer on top ofthe second chip before the continuous insulating layer is arranged onthe first chip.

According to an exemplary embodiment the method for manufacturing a chiparrangement further comprises arranging an encapsulation layer on top ofthe second chip during the arranging of the continuous insulating layeron the first chip.

In particular, the encapsulation layer may be a lamination layer orlamination sheet. According to this embodiment, the encapsulation layerand the continuous insulating layer are simultaneously arranged on thefirst chip and the carrier.

According to an exemplary embodiment the method for manufacturing a chiparrangement further comprises opening of the encapsulation layer afterit is arranged over the carrier.

In particular, the encapsulation layer may be structured by formingvias, through holes, trenches, wells or the like, which may afterwardsbe filled by a metallization or by an electrically conductive materialfor forming conductors, for example.

According to an exemplary embodiment of the method for manufacturing achip arrangement the opening of the encapsulation layer is performed bya laser.

Alternatively or additionally the opening may be performed by etching orany other process step suitable to provide vias or through holesextending through the encapsulation layer.

According to an exemplary embodiment of the method for manufacturing achip arrangement a plurality of second chips is arranged on thecontinuous insulating layer.

For example, the arranging of the plurality of second chips may beperformed simultaneously, e.g. by arranging a wafer comprising aplurality of chip, e.g. power chips and/or logic chips on the continuousinsulating layer. Alternatively, the plurality of chips may be placedsubsequently or separately from each other on the continuous insulatinglayer. After arranging the plurality of second chips on the continuousinsulating layer the same may be expanded so that the second chips havea predetermined distance from each other. It should be mentioned thatalso a plurality of first chips may be placed on the carrier eithersimultaneously or subsequently.

According to an exemplary embodiment the method for manufacturing a chiparrangement further comprises a singularizing step.

By singularizing a plurality of chip arrangements may be formed eachincluding at least two chips, e.g. at least one or two power chips andat least one logic chip. In particular, the singularizing may include anexpansion process. For example, the carrier and/or the continuousinsulating layer may comprise or may be formed by an expandable materialwhich can be expanded increasing a pitch between the chips arrangedside-by-side.

Summarizing a gist of an exemplary embodiment may be to provide a chiparrangement, e.g. a bridge circuit comprising at least one half bridgesand at least one driving circuit, comprising a lamination orencapsulating layer on an upper major surface and a lower major surfaceof chips which are arranged or placed on a carrier or chip carrier andelectrically connected with other chips arranged on the carrier as well.The continuous insulating layer may thus form an insulation layerbetween different chips arranged or fixed to the carrier andadditionally as a protection or cover layer for chips already arrangedon the carrier. In particular, a multi-chip arrangement may be formed.

Various of the exemplary embodiments of the chip arrangement or themethod of manufacturing a chip arrangement may provide one or several ofthe following advantages. When using the continuous insulating layer itmay not be necessary to use an additional or specific adhesive forfixing chips on the carrier. This may be in particular true when using aprecured thermoset or thermoplast material. Additionally, it may bepossible to provide an insulating layer having a homogenous layerthickness and thus providing homogenous isolation strength. In additionit may be possible to choose the material of the continuous insulatinglayer according to the needs, e.g. materials providing a high isolationstrength. It may further be possible that the materials of the differentlayers are tailored to each other, in particular with respect to thecoefficient of thermal expansion (CTE) and/or with respect to thecoefficient of elasticity. Thus, it may be possible that the chiparrangements may have an improved reliability. In case also sidewalls ofthe chips are covered by the continuous insulating layer it may bepossible that metal components of the chip, e.g. contact pads, may notreact to other components or materials of the chip arrangement, e.g.forming of CuSi may be reduced. According to specific embodiments it maybe possible to reduce or eliminate the usage of prepreg materialsbetween chips or as a part of an encapsulating layer. The continuousinsulating layer may also provide a complete covering of the bottom orlower side of the chips. Furthermore, the use of a continuous insulatinglayer may enable and simplify a parallelization of the manufacturingmethod.

The following detailed description refers to the accompanying drawingsthat show, by way of illustration, specific details and embodiments inwhich the invention may be practiced.

FIG. 1A shows a first step 150 of a manufacturing method of a chiparrangement, e.g. a bridge circuit, according to an exemplaryembodiment. In particular, a plurality of chips 101, e.g. power-chipsare arranged on a carrier 102, e.g. a lead frame or conductive carrier,and electrically connected to the same. The chips may be soldered orbonded, e.g. at a temperature above 300° C., to the carrier or fixed tothe carrier by an electric conductive material 103, e.g. an electricallyconductive adhesive, nanopaste or the like.

FIG. 1B shows a second step 151 of the manufacturing method. Inparticular, a plurality of further chips 104, e.g. logic chips, driverchips, memory chips or sensor chips, which should be insulated from theplurality of chips 101, are arranged or placed on a continuousinsulating or dielectric layer 105, e.g. a laminate foil, having athickness between 5 micrometer and 50 micrometer, in a predetermineddistance or pitch. The dielectric layer 105 may comprise or may consistof a precured thermoset material or high quality thermoplast material.The dielectric layer or laminated foil 105 may be filled or unfilledand/or may be fiber glass reinforced.

FIG. 1C shows a third step 152 of the manufacturing method. Inparticular, a further laminate layer or laminate sheet 106 may beprovided having a thickness of about 20 micrometer to 200 micrometer andmay comprise the same or a different material as the dielectric layer105. Optionally, the laminate layer 106 may comprise a plurality ofsublayers. 107.

FIG. 1D shows a fourth step 153 of the manufacturing method. Inparticular, the further laminate layer 106 is arranged on the pluralityof further chips 104 and is fixed to the dielectric layer 105 by apositive fit and/or adhesively joint under pressure, e.g. 100 kilopascalto 10,000 kilopascal, and/or increased temperature, e.g. at atemperature between 150° C. and 300° C. Thus, the plurality of furtherchips 104 are encapsulated on both sides.

FIG. 1E shows a fifth step 154 of the manufacturing method. Inparticular, the multilayer structure of FIG. 1D (double side laminatedchips or devices) is fixed to the carrier 101 and the plurality of chips101 arranged thereon by a positive fit and/or adhesively joint underpressure and/or increased temperature. The result, a compound composite107 of this fifth step is shown in FIG. 1F.

FIG. 1G shows the result of the sixth step 155 of the manufacturingmethod. In particular, the compound composite 107 may be processedfurther by common process steps, e.g. vias, through holes and/ortrenches may be formed and filled afterwards by a metallization 108,forming electrical connections, interconnections and/or redistributionsto the encapsulated chips.

FIG. 1H shows the result of the seventh step 156 of the manufacturingmethod. In particular, the compound composite 107 may be separated orsingularized so that a plurality of multi-chip arrangements 109 isformed. Preferably each chip arrangement may comprise at least two firstchips arranged on and electrically connected to the (electricallyconductive) carrier, and at least one second chip arranged between thetwo first chips and electrically isolated from the two first chips bythe continuous insulating layer. The two first chips may form ahalf-bridge while the second chip may be a driver chip or comprise adriving circuit.

FIG. 2 shows a part of an alternative method of manufacturing method ofa chip arrangement. In principle the alternative method may be similarto the method described in connection with FIG. 1A to FIG. 1H. However,the fourth and fifth steps 153 and 154 may be performed together. Thatis, the arranging of the laminate sheet 106 onto the dielectric foil 105(having the plurality of chips 104 placed thereon) is performedsimultaneously with the arranging of the dielectric foil 105 onto thecarrier 102. Other manufacturing steps may correspond to the exemplaryembodiment described in connection with the exemplary embodiment of FIG.1A to FIG. 1H.

It should be noted that the plurality of further chips 104 and/or theplurality of chips 101 may be placed or arranged on the dielectric foil105 and the carrier 102, respectively, by a pick and place process, i.e.as single chips. Alternatively they may be arranged in a parallelprocess, e.g. in form of placing a wafer on the dielectric foil 105 orcarrier 102. When using this parallel technique it may be preferred toarrange an expandable sticky lamination foil onto the wafer comprisingsingularized chips (e.g. singularized by expanding a so called sawingfoil), i.e. performing a re-lamination step. The expandable laminationfoil may then be expanded so that a predetermined pitch between thesingle chips is achieved. Afterwards the expanded lamination foilcomprising the singularized chip may then be connected to the dielectricfoil 105 and then to the carrier 102.

FIG. 3 shows a simplified flowchart of a method of manufacturing a chiparrangement 300. In particular, the method may comprise arranging orfixing a first chip, in particular a semiconductor chip, e.g. a logicchip, power chip or a half-bridge circuit, on a carrier, e.g. a leadframe or conductive carrier 301. Additionally, the method comprisesarranging a second chip, e.g. a driver circuit or driver chip or amemory chip or a sensor chip, on a continuous insulating layer 302,which is then arranged on the first chip which is already arranged onthe carrier 303. Optionally the multilayer structure is processedfurther, e.g. by arranging an encapsulation layer onto of the secondchip, forming holes and/or trenches in the encapsulation layer, forminginterconnections in the holes and/or trenches, and the like. Thus, amulti-chip arrangement or device may be formed, wherein the chips areelectrically isolated from each other by a continuous insulation layerarranged between the chips.

It should be noted that the term “comprising” does not exclude otherelements or features and the “a” or “an” does not exclude a plurality.Also elements described in association with different embodiments may becombined. It should also be noted that reference signs shall not beconstrued as limiting the scope of the claims. While the invention hasbeen particularly shown and described with reference to specificembodiments, it should be understood by those skilled in the art thatvarious changes in form and detail may be made therein without departingfrom the spirit and scope of the invention as defined by the appendedclaims. The scope of the invention is thus indicated by the appendedclaims and all changes which come within the meaning and range ofequivalency of the claims are therefore intended to be embraced.

What is claimed is:
 1. A chip arrangement comprising: a carrier; and atleast two chips arranged over the carrier; wherein a continuousinsulating layer is arranged between the at least two chips and betweenthe carrier and at least one of the at least two chips.
 2. The chiparrangement according to claim 1, wherein the carrier comprises anelectric conductive material.
 3. The chip arrangement according to claim1, wherein the insulating layer comprises a material which has a meltingtemperature of above 200° C.
 4. The chip arrangement according to claim1, wherein the insulating layer comprising at least one material out ofthe group consisting of: a thermoset material, a thermoplast material; arubber material; and a mixture thereof.
 5. The chip arrangementaccording to claim 1, wherein the continuous insulating layer is alaminate layer.
 6. The chip arrangement according to claim 1, furthercomprising an encapsulation layer which is arranged over the at leasttwo chips.
 7. The chip arrangement according to claim 6, furthercomprising interconnections extending through the encapsulation layer.8. The chip arrangement according to claim 1, wherein the continuousinsulating layer is adapted to act as an adhesive material for the atleast one of the at least two chips.
 9. The chip arrangement accordingto claim 1, wherein the carrier has a thickness in a range between 100micrometer and 1,000 micrometer.
 10. A chip arrangement comprising: acarrier; a first chip arranged on the carrier; a second chip arranged ona continuous insulating layer and beside the first chip, wherein thecontinuous insulating layer is arranged on the first chip.
 11. The chiparrangement according to claim 10, wherein the continuous insulatinglayer is arranged on at least three sides of the first chip.
 12. Thechip arrangement according to claim 10, further comprising anencapsulation layer.
 13. Method of manufacturing a chip arrangement, themethod comprising: arranging a first chip on a carrier; arranging asecond chip on a continuous insulating layer; and arranging thecontinuous insulating layer on the first chip arranged on the carrier.14. The method according to claim 13, wherein the continuous insulatinglayer comprising a material which is adhesive when the second chip isarranged on the continuous insulating layer.
 15. The method according toclaim 13, further comprising: arranging an encapsulation layer on top ofthe second chip before the continuous insulating layer is arranged onthe first chip arranged on the carrier.
 16. The method according toclaim 13, further comprising: arranging an encapsulation layer on top ofthe second chip during the arranging of the continuous insulating layeron the first chip arranged on the carrier.
 17. The method according toclaim 15, further comprising opening of the encapsulation layer after itis arranged over the carrier.
 18. The method according to claim 17,wherein the opening of the encapsulation layer is performed by a laser.19. The method according to claim 13, wherein a plurality of secondchips is arranged on the continuous insulating layer.
 20. The methodaccording to claim 13, further comprising a singularizing step.